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hello, I have question about junction temperature.
I thermal simulated the chip (CPM2-1700-0045B, CREE) in LTspice.
However, I do not understand because it is very different from the chip (C3M0045065D, CREE) result.
The result of the chip (C3M0045065D) is that the heat gradually increases and...
Looking for thermal resistance in the LM317 datasheet from TI, I found something which doesn't make any sense to me.
https://www.ti.com/lit/ds/symlink/lm317.pdf
Page 4
There're two TO220 packages, which seem differ in the thickness of the tab.
One of them is 4.2 ºC/W junction-case, which is...
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