I heat up one pad, without the component in position - then add a tiny bit of solder to that pad. Re-heat it, and place the component into position with tweezers, so it cools and holds it in place. Then, with my iron at an angle (its a pointed tip) lay it across the pad/component edge and just touch it with very fine (0.3-0.6mm) solder. Then drag the iron sideways, rather than lifiting it up. Always ends up with a perfect joint for SMT passives. 1206 right down to 0402.
If it looks messy afterwards, like I've used too much solder (less is more! thus the thin solder wire) then, a flux pen, dabbed at each end, then a quick reheat on a well cleaned iron tip, quickly neatens it up.