On the packaging of the SOIC chips (they are TMS3705ADR RFID modules btw), there is a warning saying that I should bake prior to vapor or IR soldering to reduce the chances of damage. After performing a brief google search, I have come across (**broken link removed**). The link suggests storing spare chips in a desiccator cabinet. Do I absolutely have to store those chips in those cabinets in order to avoid damage?