Desiccator Cabinets

On the packaging of the SOIC chips (they are TMS3705ADR RFID modules btw), there is a warning saying that I should bake prior to vapor or IR soldering to reduce the chances of damage. After performing a brief google search, I have come across (**broken link removed**). The link suggests storing spare chips in a desiccator cabinet. Do I absolutely have to store those chips in those cabinets in order to avoid damage?

If this is a commercial product then I would suggest that you follow every recommendation you possibly can just to cover yourself. If this is a prototype or a home product, then I wouldn't worry about it. The concern is that the package absorbed a lot of moisture and soldering the part in a reflow oven will cause the moisture to vaporize and crack the package.

If you had 1000000 parts that all absorbed a lot of moisture and were baked in a reflow oven before drying them out, I'd be interested to know what the failure rate would be.

I just have 3 chips in stock for a prototype, so I guess storing the leftovers in the same bag while sealing it properly should be good enough?

yup
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