BuffaloEngineer
Member
I was taking a look at a PCB and they covered their top and bottom layer with a ground plane between all the traces. It's a 4 layer board, with a PWR and GND layer (I assume). They also put vias around the perimeter of the whole PCB connecting the ground planes. Is this for electromagnetic compatibility (EMC)? Thermal? Both / neither?
Are there some good web references on the advantages / disadvantages of this approach? Thanks!!
Are there some good web references on the advantages / disadvantages of this approach? Thanks!!