Hi,
Thanks for all these great replies, I think we will just have to end up trying to solder it without soldering the centre pad, as some of the small pads of the QFN achieve a ground connection anyway.
The footprint pads emerge 0.3mm outside the QFN body outline all the way round.
We have got a hot plate but I am not convinced a great deal of heat will conduct through the 4 layer FR4 PCB. Some other components on the top side are already placed, as we needed to run the board manually (without the micro) first.
Hot air-gunning i think is best if you actually aim it at the dead centre of the chip and try and "burn" it on through to the tinned solder pads?