shirazmacuff
New Member
Hi guys
I’m working on a project using the following IC “ v574”
74VHC574
Octal D-Type Flip-Flop with 3-STATE Outputs
It is a SSOP-1 package
My problem is that I would like to know what the max temperature the device could withstand while in the oven or if there is another way of soldering such small components on PCB. I, m currently using a self made oven and after the device is soldered the device works for about 5 minutes and then it shorts out I know the device is mosfet technology and I’m taking all the necessary precautions.
The data sheet has the following rating
Storage Temperature (TSTG) 65°C to +150°C
Junction Temperature (TJ)
PDIP 140°C
Do you think if power is NOT applied to the device, could it withstand 225 °C for approximately 1 minute?
Has anyone used this device or similar?
Can I use a different PACKAGE during prototyping?
Thanks in advance guys
I’m working on a project using the following IC “ v574”
74VHC574
Octal D-Type Flip-Flop with 3-STATE Outputs
It is a SSOP-1 package
My problem is that I would like to know what the max temperature the device could withstand while in the oven or if there is another way of soldering such small components on PCB. I, m currently using a self made oven and after the device is soldered the device works for about 5 minutes and then it shorts out I know the device is mosfet technology and I’m taking all the necessary precautions.
The data sheet has the following rating
Storage Temperature (TSTG) 65°C to +150°C
Junction Temperature (TJ)
PDIP 140°C
Do you think if power is NOT applied to the device, could it withstand 225 °C for approximately 1 minute?
Has anyone used this device or similar?
Can I use a different PACKAGE during prototyping?
Thanks in advance guys
