Hi Jason,
the required drill size will be a problem. Your PCB manufacturer has a good opportunity to improve production using laser for drilling.
I managed to get the SMD pads circle shaped and adapt the vias accordingly.
These are the paramters used for pads and vias:
SMD pad: dia 13mils, roundness 100%
Vias: dia 13mils, shape round, drill size 9mils (uncheck Thermal, Stop and First)
The drill size however is 8mils. Trace width for all traces is 10mils.
Connections between pins on the adapter are omitted.
If you get the adapter board made make sure to fill the vias with solder tin up to the top.
BGA components are delivered with tiny solder balls on the pads. If the solder is soaked by the drill hole of the via there will be a poor connection of the solder pads between IC and PCB.
Please PM me your email address.
Regards
Boncuk