What is the correct way to place and connect decoupling caps on a 4 layer board? Top and bottom layers for routing, L2=+5V L3=GND. SMD and DIL packages. I've put the packages on the top layer, and the caps (100 nF 1206 smd) under the packages, on the bottom layer.
The DILs power pins connects directly to the inner layers. How should I route the caps for optimal result? Directly down to the power layers, or to the IC pins? It's my first 4 layer board. I'm used to place decouplings as close to the ICs as possible and connected directly to the power pins.
The DILs power pins connects directly to the inner layers. How should I route the caps for optimal result? Directly down to the power layers, or to the IC pins? It's my first 4 layer board. I'm used to place decouplings as close to the ICs as possible and connected directly to the power pins.