With SMT components becoming ubiquitous, they find their way into more and more projects.
Although one can solder a SMT component with thin solder wire, once that one has employed solder paste and reflowed it, and seeing how much better the whole process is, one does not want to go back to soldering with solder wire.
The problem with solder paste is of course, its limited shelf life (even with refrigeration) as compared to solder wire. And with the minute quantities that SMT components require, even the smallest solder paste presentation will last a very long time.
So, the question begs: how does one know whether the solder paste is still good?
I found the following very simple test, which I'm reproducing for the benefit of forum members:
In order to gauge the degradation, it is best to put a small amount of paste on a non-wettable substrate, like a piece of ceramic. Reflow the paste and see how well it coalesces. If coalescence is good, the solder paste will reflow into a ball, surrounded by a flux pool that is relatively free of uncoalesced solder particles. If the paste has significantly degraded, the paste will not coalesce well and there will be a significant amount of uncoalesced solder particles in the flux pool.
Although one can solder a SMT component with thin solder wire, once that one has employed solder paste and reflowed it, and seeing how much better the whole process is, one does not want to go back to soldering with solder wire.
The problem with solder paste is of course, its limited shelf life (even with refrigeration) as compared to solder wire. And with the minute quantities that SMT components require, even the smallest solder paste presentation will last a very long time.
So, the question begs: how does one know whether the solder paste is still good?
I found the following very simple test, which I'm reproducing for the benefit of forum members:
In order to gauge the degradation, it is best to put a small amount of paste on a non-wettable substrate, like a piece of ceramic. Reflow the paste and see how well it coalesces. If coalescence is good, the solder paste will reflow into a ball, surrounded by a flux pool that is relatively free of uncoalesced solder particles. If the paste has significantly degraded, the paste will not coalesce well and there will be a significant amount of uncoalesced solder particles in the flux pool.