While the use of via-in-pad technology is no longer regarded as an unacceptable way to resolve a design problem, it should only be used if no other options are available. Because of additional steps and material required, the requirement for filling vias adds to the cost of manufacturing the circuit board, and may have a negative effect on yields. In addition, the choice of circuit board fabricators is limited to vendors who indicate that they have the capability of properly filling vias. Proper filling is emphasized, as circuit boards with improperly filled vias will incur additional costs during assembly to correct the problem. Corrective measures required will include identifying and fixing defective vias prior to the application and reflow of solder paste, as well as additional inspection and post-reflow rework to ensure that affected solder joints have sufficient solder.