Via-in-Pad in PCB Design

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Sophia Zeng

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1. Via holes filled by resin
2.Via holes filled by copper
How to choose if it should be better to filled by resin or filled by copper?
 
Part of the question is what you're trying to accomplish.
If it's just to prevent solder thieving, then either choice is good.
If the component is a power device, and you need to carry heat away through the via, then copper is the better choice. Copper is usually more expensive.
But check with your PCB fabricator to see what their options are and what surcharge the two choices have. This will vary between vendors.

Of course, the better is to avoid vias in pads, unless specifically needed for heat transfer.
 
Thank you,the copper cost is higher than resin,so maybe it will be better.
 
If the pad with the via is either a ground or voltage supply pad, which connects the IC to either a ground or power plane, copper will ensure the lowest possible resistance.
 
I'd absolutely say copper for BGA pads - they are rather critical connections and the last thing you want is a pad to not "wet" correctly or the solder ball get offset & risk a short due to solder not flowing over a resin fill.
 
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