mvs sarma
Well-Known Member
I've avoided using surface mount parts in my kits because I'm concerned my customers may not want to tackle the difficulty.
That said I'd like to use a few surface mount ICs in the next kit. It's trivial to solder an 8 pin SOIC, very simple actually just a little tape and patience works great.
As for larger SOIC not too bad as long as you tack down one corner and tape the IC in place. Solderwick is handy for soaking up excess solder.
But TQFP is another story, you have to get it lined up perfectly and you will need solderwick. They are also very difficult to reposition once you solder them to the PCB. 64 & 80 pin TQFP can be a chore.
Comments?
It is not that difficult if you have a Hot-air gun and SMD rework station
i see guys easily lifting off the TQFP chips just with Hot-air gun and a thin knife.
even i could solder , remove and re-solder one CY27EE16 chip y-day. without any of hose things
of course it is SSOP 20. what all i had is only a mini soldering station.
Last edited: