The caps should be rated to take soldering temps for so long.(and the electrolytic caps as well, which might damage them).
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The caps should be rated to take soldering temps for so long.(and the electrolytic caps as well, which might damage them).
The caps should be rated to take soldering temps for so long.
also keep in mind that some of the "fixes" posted on places like many xbox a forums and on youtube (or even on forums about laptops, etc) are "spoilers". one of my son's asked me to look at a particular "fix" for an xbox bga chip that was posted on an xbox forum, and from what i could see was guaranteed to "let the magic smoke out" rather than fix the problem.... many of these spoilers are posted by people with a malicious sense of humor. IIRC, the "fix" was to bake the board in a microwave oven for 30 seconds....
believe it or not, but the chip can take a bit more heat than you think... there's a reflow method i've seen that actually has the heat gun on the chip for about a minute and a half... i was somewhat surprised by that, and think it may have something to do with the reason Onkyo's method never worked for very long. Onkyo's method was 30 seconds of heat (and even at 30 seconds, the solder on the resistors and caps around the chip begins to discolor a bit). the odea of soaking the area under the chip with liquid flux may help some, since it changes the surface tension of the solder, and keeps the chip centered on the grid.