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Its not impossible to cut a IC and still use it:
**broken link removed**
Also most DIE are in center of IC. You could always make a adapter to turn the 14 pin device into a 8 pin dip as a better choice.
Its not impossible to cut a IC and still use it:
**broken link removed**
Also most DIE are in center of IC. You could always make a adapter to turn the 14 pin device into a 8 pin dip as a better choice.
The IC has to be big so there is room for the legs.I didn't understand how he powers the IC. If most of the die remains at the centre then why the make ICs big?
I didn't understand how he powers the IC. If most of the die remains at the centre then why the make ICs big?
So, its just to facilitate soldering manually.The IC has to be big so there is room for the legs.
Chip on board (COB) or chip on glass (COG) avoid that need. Other technologies are reducing size requirements for chips with external connections, but they are increasingly harder to solder manually.
John
Standard pin spacing is 1/10th of an inch, so in order to space the pins properly, the chips must be made large.
So, its just to facilitate soldering manually.
Why not change that standard?
They have, its called surface mount.
I see ... may i have the datasheet/IC number of any equivalent ic? like those equivalent to basic 74*** series .