I have been following this thread and want to raise a point as a possible reason for failure.
As has been stated, I don't doubt that this is a "known" problem in certain cases. I am curious as to understanding why it occurs.
I read a couple of items that got me thinking about the puzzle. The data sheet (as posted), this
stackexchange and this
**broken link removed**.
To make a long story short, the data sheet includes these two notations:
When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted film temperature is not exceeded.
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.
For the first point, the film temperature is the upper operating temperature, so that is understandable.
But the second point is much less specific. If drift, were measured as a percentage of initial resistance (it may not be), the effect would not be the same comparing one R vs 3X R/3. Let's say, for the sake of argument only, a 10% drift. The case of a single R drops to 10584, where each of the R/3 drop to 353.
My thinking (which is admittedly not thorough) is that a "limit" could be exceeded in the case of one of the R/3, before the R. The result is consistent with what is observed - 3 X R/3 fails before 1 X R.