Oznog
Active Member
Well, I got my first prototype boards I've sent out for mfg. Three things came up so far:
1. CadSoftUSA's Eagle PCB layout library doesn't have a correct hole size for the TO-252A pkg. Bummer, I'm dremel-ing down the leads.
2. Left off 3 resistors I needed, and the diode I grabbed out of the library for a Schottkey has holes too small too.
3. The silkscreen goes RIGHT over the pads for a fine pitch SMD pkg. I hadn't thought about that. This is a problem, if I use chemical removers I might strip the solder mask or chemically alter the pad's tinned surface which may complicate the mounting process with surface mount paste.
Is there a good way to do this? I tried laquer thinner on a q-tip on another spot where the silkscreening for the TO-252's pkg goes right over the TO-252's solder pad, and it doesn't do anything. Maybe I should try aceone? I tried a Dremel wire brush, but it seemed to want to remove the tin more than the silkscreen.
1. CadSoftUSA's Eagle PCB layout library doesn't have a correct hole size for the TO-252A pkg. Bummer, I'm dremel-ing down the leads.
2. Left off 3 resistors I needed, and the diode I grabbed out of the library for a Schottkey has holes too small too.
3. The silkscreen goes RIGHT over the pads for a fine pitch SMD pkg. I hadn't thought about that. This is a problem, if I use chemical removers I might strip the solder mask or chemically alter the pad's tinned surface which may complicate the mounting process with surface mount paste.
Is there a good way to do this? I tried laquer thinner on a q-tip on another spot where the silkscreening for the TO-252's pkg goes right over the TO-252's solder pad, and it doesn't do anything. Maybe I should try aceone? I tried a Dremel wire brush, but it seemed to want to remove the tin more than the silkscreen.