Mr RB
Well-Known Member
I am a professional power supply designer...
I know! That's why i used the smileys. The point I was trying to make was that bolting some IC's to a big slab of metal heatsink and pumping enough amps into a messy vat of acid might not require the "finesse" of a pro power supply engineer doing heatsink thermal resistance calcs...
...
Even assuming the LM338 devices are in the large TO-3 package (which is the best for heat transfer) the thermal resistance from IC to the heatsink will be about 1.5C/w. If the device did not have thermal shutdown, 100W of dissipation would spike the die temp to over 175C even if the case was held at 25C using an infinite heatsink. Thermal shutdown will kick in at 160C, which will cut off or reduce output current very quickly.
A very good point. I think you might be still a little conservative on the figures, the datasheet says MAX junction-case of 1'C/W so it's probably not that bad. Many TO-3 devices are rated at >100W but they are usually the alloy package not the crappy steel ones like the LM338K.
The anodising voltage curve looks a lot like a cap charging curve, the 100W will drop fairly quickly as the coating builds.
But you are still right, Ceefna needs to reduce the DC voltage well under 20v (which means he won't get a good anodised layer) or needs to change the circuit by adding more LM338's or some other solution...
Ceefna- if you use a 100 ohm pot you need to increase the pot current by reducing the LM117 fixed resistor to 100 ohms.