Desoldering chip components - Advice needed

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Naveenravindran

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Hello,
I'm trying to desolder some chip components (from 0402 to 1210). Problem is I need to do this after I clean the board to gauge the cleanliness underneath the components. So this desoldering process should not leave any residues/wetness behind. Any suggestions for a proper way of achieving this would be appreciated. Any suggestions on the desoldering equipment that i can use would also be very helpful.
Thanks in advance!!

Naveen.
 
The 0402 to 1210 are surface mount resistors with only 2 connections?
There are tools you can buy. They are soldering iron which look like a pair of plier. You clamp onto both ends of the resistor with the tool, and lift it up when the solder melts. These sort of tool can be quite expensive.
Or you can use desoldering braid ( might called different in different country) and the hot solder iron. Melt the solder with the iron and soak the solder into the braid.
 

The industry uses hot air pencils for this kind of thing. I like this one:
https://www.hakko.com/english/products/hakko_851.html

buy any hot air pencil with a fine tip will work well (fine=1.0 to 2.0 mm diameter). Of course, you need very good quality tweezers too.
 
Naveenravindran said:
So this desoldering process should not leave any residues/wetness behind.
Are you doing this for QC purposes? Any desoldering you do will disturb any residues/wetness underneath the component because you are applying heat to the area. Have you thought of grinding or cutting them off? There is also a method of using a dye to flow under the components and then prying them off to see where the dye flowed. ie: can you do destructive disassembly?
 
Thanks for your replies.

Wingmax, the components have only 2 connections. I have an SOT23 as well that has 3 connections.

kchriste, unfortunately I cannot do destructive testing. The components themselves have to be inspected after removal.

I contacted PACE regarding this and they suggested the following:
The ST-75 system that comes with a SX-90 handpiece. I have to get the proper tips separately.
https://www.pacedirect.com/product.php?id=1685

https://www.pacedirect.com/product.php?id=1587

If this doesnt work, they have suggested the MT-100 tweezers
https://www.pacedirect.com/product.php?id=1583

or the TT-65 tweezers
https://www.pacedirect.com/product.php?id=1589

All these seem to be expensive options and I really dont want to invest in something and find out it doesnt work

What do you guys think?
 
OKi makes a hot air only station that is fabulous. I have used it and a Pace MBT-350 full rework station and for hot air the OKi unit was way better. But the pace also did suction desoldering, tweezers, etc.

The OKi unit is $500.

Are you de-populating entire boards or individual parts?
 

There is one more trick you can try. Buy some low melting point solder and soler it onto the joints. The idea is the low melting point solder will stay in liquid form when hot for long time, so you just lift off the component with a plier while the solder still melts. That's what we use to remove multiple pins surface mount IC the economical way, and it's quite safe, but may be bit messy. Good luck.
 
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