"slimar" in that both are N channel MOSFETs in TO-220 packages.
Not so "slimar" in that the drain to source on resistance of the F12N101 is over 7 times greater than that of the IRLZ44. That means 7× more power dissipation in the F12N101 than in the IRLZ44.
At 2.75 amp drain, the means 0.077w power dissipation vs 0.54w. Neither of which seems like it should be much of a problem.
What temperature is "too hot"? How did you decide? The lowest maximum allowed temperature for these two MOSFETs is 150°C which is 302°F.
As for the thermal pad, why would a manufacturer specify "what's connected to the tab" when nothing is connected to the tab? That fact is clearly called out at the top of the page where they say it's a "TO-220AB" package (AKA: TO-220-3) a three pin device with no pad connection.
In your haste to big an even bigger ass, you missed the key points and are seriously mistaken on that point.
● When I posted my answer, the only information given was "N channel MOSFETs in a TO-220 package".
● This picture, from an IR datasheet which I posted originally, shows a schematic symbol with D, G and S identified without pin numbers and a picture of the package without pins being identified in any way.
● Your claim that a TO-220 AB package has nothing connected to the tab is absolutely false as the picture posted immediately prior to your second outburst, which is from the F12N101 datasheet, shows the tab connected to the drain in a TO-220 AB package.
If you had actually answered MrDEB's question, instead of attacking me, the drains of all the MOSFETs would be connected together....and a wasteskd circuit board would have been the result. Fortunately(?), you seem to prefer arguing than answering questions, so no harm done.
Datasheet for what exactly? Please refer to the first post.
You make the erroneous claim that the tab is isolated in a TO-22O AB package. Please open your eyes, use whatever vision-assit aid you need, and look at the picture in post #24, which if from the datasheet for one of the MOSFETs MrDEB has.
And based on the datasheets' confirmation that both transistors are using TO-220AB style packages (AB suffix means only the three leads are connected - the thermal Tab is not electrically connected) - which means you can connect all of your transistors together without a problem.
And based on the datasheets' confirmation that both transistors are using TO-220AB style packages (AB suffix means only the three leads are connected - the thermal Tab is not electrically connected) - which means you can connect all of your transistors together without a problem.
One thing I have pondered..... Why isn't the source the tab on MOSFETs. If you have a number of MOSFETs, it seems most likely the source of all goes to a common power supply. The gates or drains in parallel is unlikely.
I suppose it has to do with the internal arrangement and need for heatsinking
MrDEB
If you check the continuity from the thermal pad to each lead, and all are disconnected from the pad, you can safely mount all to the same heat sink without a problem - no need for added insulation between thermal pad and heat sink.
ZipZapOuch I guess you are unable to admit you're wrong even in light of overwhelming evidence. *Shrug* Perhaps you should stop picking fights.
If MrDEB follows your advice, will you take responsibility if the MOSFETs he uses next time don't exhibit the same rare property of an isolated tab? If indeed the current ones do (hint, they won't)?