You've ignored thr comments about stitching the top and bottom layers of the heatsink zones together. If you don't understand something, ask instead of ignoring it.
"Reduce Heat dissipation
"When current flows through a conductor, such as a trace or via, a certain amount of heat is generated due to the resistance of the material. In high-current applications, this heat generation can be substantial. By strategically placing stitching vias, designers can create a pathway for heat to flow from areas of high heat generation to areas where it can be dissipated more efficiently. This helps in spreading out the heat, preventing localized hotspots, and maintaining more uniform temperatures across the PCB."
Put small diameter vias around the edges of each heatsink area to allow for heat transfer through the board. The vias must be connected to the same net as the MOSFET tab in each area.
Where are the 12v connections to each strip?