i can see them. some have two and others have more. i assume its because of room and that there are existing tracks going to the pad.
i did get an error when i added the top pour layer. A single pad U3.6 (pin6) did not receive any thermals. the images below show the same area with each layer. is this a problem? the green image is the bottom layer, blue is the top, then one shows both. I can see that the pours did alter my tracks. i can see many tracks in the image that is showing both layers. All very interesting. i hope i have provided you with enough detail to see that i have done a good job here and most importantly that the issue with pin6 is really an issue. it is a DIP socket and not a component.
Pin 6 did not receive a thermal because the pour has no way to connect. It is blocked by tracks. It needs to be corrected.
It would be easier for me to help if you could zip up and post your PCB, schematic, and project file.
And I'll take a look.
If I can I'll fix it and upload. Then we can discuss further